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Jingchuang Advanced completed hundreds of millions of yuan in Series B+ financing, focusing on independent innovation of semiconductor precision grinding and marking equipment
March 8, 2023
Recently, Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. (hereinafter referred to as "Jingchuang Advanced") completed the B+ round of financing. This round of financing was led by Qiming Venture Capital, and was jointly invested by Shenzhen Venture Capital, Guofa Venture Capital, Changshu Guofa, Economic Development State Development, Nanjing New Industrial Investment, Soochow Venture Capital and others. This round of financing will mainly support new technology research, new product development, fully automatic product capacity expansion, market promotion and brand building.
Jingchuang Advanced was established in 2013. It is a high-tech enterprise specializing in the research and development, production, sales and service of semiconductor precision dicing, grinding and polishing equipment.
For a long time, semiconductor precision dicing, grinding, and polishing equipment have been in a situation where the entire value chain is monopolized by foreign countries. The core members of the founding team of Jingchuang Advanced have been deeply involved in the industry for more than 20 years, and have excellent relevant technologies and rich experience. The team adheres to the inheritance and innovation of technology, constantly breaks through and innovates, and targets end customers who attach great importance to equipment production capacity and complete machine stability. It is committed to exploring and promoting the independent innovation process in the field of semiconductor precision dicing, grinding, and polishing equipment.
Jingchuang Advanced has successfully taken the lead in realizing independent innovation in the industrialization of 12-inch fully automatic precision dicing machines. In addition to the main channel of dicing equipment (providing various types of dicing equipment from 6-12 inches from semi-automatic to fully automatic to meet the precision dicing needs of different industry applications), the product line has expanded to multiple semiconductor professional equipment fields such as JIG SAW equipment, grinding equipment and other advanced processes. Jingchuang's advanced team ensures the long-term maintenance and reliability of the complete machine's high precision through three-dimensional simulation design technology, precision machining and heat treatment technology for high-precision machines, multi-dimensional motion control linkage optimization technology, and geometric error software algorithm compensation technology.
At the same time, relying on the large number of customer needs and precision scribing process experimental data accumulated over many years of deep cultivation in this field, the underlying algorithm and human-computer interaction interface software design based on this are also the key to the industrialization transformation of the equipment. At present, Jingchuang's advanced series of products have been applied in batches to complex and precise dicing of various semiconductor materials or pan-semiconductor materials, and are widely used in chip dicing production of semiconductor integrated circuits, GPP/LED gallium nitride and other chips, discrete devices, LED packaging, optical communication devices, surface acoustic devices, MEMS and other chips.
Due to the diversity of semiconductor market demands, the rapid development of technology, and the ultra-high-precision characteristics of semiconductor equipment, it is difficult to achieve assembly line mass production. Therefore, two problems will be encountered in the industrialization process: first, how to achieve high precision of the entire machine while ensuring efficient and stable output; second, how to deliver customer customized needs quickly and efficiently due to process differences. Gao Yang, vice president of R&D at Jingchuang Advanced, pointed out, "The current solution adopted by Jingchuang Advanced is to improve the versatility of parts and components, use modular design to achieve efficient interchange, reduce the difficulty of process control, and be more conducive to standardized operations; in addition, actively promote strategic cooperation with high-quality suppliers, and adopt modular solutions in the form of OEMs, which have obvious effects on overall machine quality control, installation efficiency improvement and production capacity improvement."
In the future, with the help of multiple industrial capitals, Jingchuang Advanced will accelerate its transformation from a "single category semiconductor equipment manufacturer" to a "multi-variety, multi-category semiconductor equipment solution platform company". From the improvement of basic theories, the formulation of corporate industry standards, and the continuous exploration of advanced packaging processes, to the improvement of refined management capabilities, rapid integration of superior resources, and building brand influence, Jingchuang Advanced is "cultivating itself" in all aspects of "ten years of sharpening a sword", aiming to create greater value for more customers in the future and make the independent innovation process of semiconductor precision dicing, grinding, and polishing equipment faster and more stable.
Ye Guantai, a partner at Qiming Venture Partners, said: "In the next few years, China's newly built 12-inch semiconductor wafer production capacity will rank first in the world, and the demand for front- and back-end semiconductor production equipment will also be close to 30% of the world's. This brings huge development space to Chinese manufacturers. At present, almost all key packaging equipment is monopolized by imported brands. For example, the localization rate of dicing machines is less than 10% After a long period of research and development, Jingchuang Advanced's team has mastered key core technologies, and its product technology capabilities have reached China's leading level. Many products have been mass-produced and have been applied to China's head packaging and testing plants, including dicing machines, sorting machines and grinding machines. We look forward to Jingchuang Advanced's future development into a world-class semiconductor equipment company, providing products and services to the global market."
Focusing on the fields of high-precision sealing, grinding and polishing technology, we are committed to providing advanced integrated solutions for independent, serialized and intelligent semiconductor domestic equipment and supporting processes.