Jingchuang Advanced has been deeply involved in the field of semiconductor wafer precision grinding and polishing equipment for many years. It focuses on the independent research and development and mass production of a full range of process equipment for dicing, grinding, and polishing. Relying on its self-developed core technology, it continues to output complete sets of dicing, grinding and polishing solutions with high precision, high stability, and high product yield to global semiconductor upstream and downstream enterprises, fully meeting the wafer precision processing and mass production needs of customers in multiple fields such as third-generation semiconductors and power devices.