Customized solutions

Customized solutions

We provide integrated services from equipment customization, process development to mass production introduction. We are equipped with a professional packaging process laboratory and technical team. We can conduct exclusive process parameter debugging and solution optimization according to customers' different packaging structures, material characteristics and yield requirements, effectively improving the processing accuracy and production efficiency of the packaging process, and helping customers achieve high-reliability packaging and testing mass production in the fields of power devices, optical communications, automotive electronics and other fields.

LOGO-JCA-DG

Focusing on the fields of high-precision sealing, grinding and polishing technology, we are committed to providing advanced integrated solutions for independent, serialized and intelligent semiconductor domestic equipment and supporting processes.

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Inch dicing machine AR6000 Precision dicing machine 12-inch dicing machine AR7000 12-inch dual-axis dicing machine Double-knife dicing machine AR8000 Laser dicing machine ALR4000 Wafer dicing dicing machine Precision dicing machine QFN dicing Quartz dicing Glass dicing Carbon brush dicing 6-inch dicing machine AR3000 dicing blade AR9000 fully automatic dual-axis dicing machine Jingchuang advanced dicing machine Jingchuang dicing machine Jiangsu Jingchuang Changshu dicing machine silicon wafer dicing LED dicing optical communication dicing automatic alignment knife mark analysis cleaning machine laminating machine dicing machine accessories

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