On March 27, SEMICON China 2026, the three-day top event in the global semiconductor industry, concluded successfully at the Shanghai New International Expo Center. As the leading manufacturer of semiconductor back-end dicing, grinding and polishing equipment in China, Jingchuang Advanced has made a stunning appearance with brand-new technical solutions and blockbuster new products. During the exhibition, there was a constant flow of visitors to the booth, and the cooperation negotiations were fruitful, which fully demonstrated the core strength and industry influence of Jingchuang Advanced in the field of semiconductor dicing, grinding and polishing.

During the exhibition, Jingchuang Advanced's booth has always maintained high popularity. Upstream and downstream customers, industry experts, partners and media friends from various fields of global semiconductors have come one after another to stop and communicate. On-site consultations and negotiations continued one after another. Jingchuang's advanced and professional technical and sales teams used one-on-one detailed explanations to provide each visitor with an in-depth breakdown of the product's technical advantages, process solutions and localization results. It received a large number of cooperation intentions and high recognition from industry colleagues, and became one of the exhibitors that attracted much attention in the dicing, grinding and polishing equipment track of this exhibition.

The core highlight of Jingchuang Advanced in this exhibition is undoubtedly the ribbon-dicing ceremony for the new product launch of the JTA-9612 fully automatic grinding, polishing, pasting and peeling machine jointly held with Japan's Takatori Co., Ltd. As a world-renowned semiconductor precision processing equipment manufacturer, Japan's Takatori Co., Ltd. has profound technological accumulation and global market reputation in the field of ultra-thin wafer peel-off film. The JTA-9612 all-in-one machine jointly released by the two parties this time is a one-stop solution for the needs of ultra-thin wafer processing. It breaks the efficiency bottleneck and precision loss problem of traditional multi-step sub-equipment processing, and can realize the full-process closed-loop control of ultra-thin wafer processing, greatly improving the processing yield and production efficiency. It is a perfect fitAdvanced packaging, power semiconductors, radio frequency chips and other high-end fields demanding processing requirements.

The ribbon-dicing ceremony was held in a lively atmosphere, attracting a large number of spectators to stop and watch and take photos. Leaders of enterprises and governments from both sides, representatives of overseas agents, and representatives of industry associations jointly cut the ribbon for the new product, marking the official launch of this blockbuster new product and opening a new chapter of in-depth cooperation and win-win development between Jingchuang Advanced and Japan's Takatori in the field of high-end semiconductor equipment.

In addition to the newly released all-in-one machine, Jingchuang Advanced also brought high-simulation models of a variety of core equipment to this exhibition, covering all back-end core links such as semiconductor wafer dicing and grinding. Each model intuitively restores the core structure and technical highlights of the equipment, and cooperates with the professional explanations of on-site engineers to clearly present the complete technical layout of Jingchuang Advanced in the dicing, grinding and polishing industry and the core advantages of localized solutions. Many customers stopped in front of the model for in-depth research and detailed inquiries, and conducted in-depth exchanges around issues such as equipment parameters, process adaptation, and production line implementation. They spoke highly of Jingchuang's advanced technology research and development capabilities and product maturity.

The three-day event came to a successful conclusion, and the pace of progress never stops. At this SEMICON China 2026, Jingchuang Advanced not only gained fruitful cooperation results and industry recognition, but also listened more closely to market demands and industry development trends, and accumulated valuable first-line experience for subsequent technology research and development and product iterations.

In the future, Jingchuang Advanced will always adhere to the mission of "providing excellent dicing, grinding and polishing solutions to help global customers break through manufacturing limits", continue to develop high-end semiconductor back-end dicing, grinding and polishing equipment, increase investment in core technology research and development, and deepen international technical cooperation and industry chain collaboration. With more advanced technology, more reliable products, and better services, we will solve the industry's "stuck neck" problem, help the high-quality development of China's semiconductor industry, and join hands with global industry chain partners to start a new journey of the semiconductor industry.