8-inch dual-axis fully automatic precision dicing equipment
AR6820
The AR6820 is an 8-inch dual-axis fully automatic precision dicing machine that can support precision dicing of silicon wafers, quartz and other materials. It covers multiple industry applications such as IC and medical devices. It has excellent dicing accuracy and its automation efficiency is comparable to imported products. It has now achieved industrial sales and has been recognized by a large number of customers.
Processing size
Spindle configuration
| Classification | Parameter name | Parameter value |
|---|---|---|
| working size | - | Φ6" - Φ8" |
| Configuration | Spindle form | biaxial |
| Spindle | Output power | 1.2/1.8/2.4/3.0 kW |
| Maximum speed | 60000 rpm | |
| Blade size | - | 2" |
| Y1/Y2 axis | Single step amount | 0.0001 mm |
| In place accuracy | ＜0.003 mm/210 ＜0.002 mm/5 | |
| Dicing range | 210 mm | |
| X-axis | Feed speed input range | 0.1-600 mm/s |
| Z1/Z2 axis | Single step amount | 0.0001 mm |
| In place accuracy | ≤0.001 mm | |
| θ axis | Maximum rotation angle | ±15″ |
| Washing station | Rotation speed | 100-3000 rpm |
| Cleaning method | Fully automatic rinse and dry | |
| Working voltage | - | Three-phase 380V 50Hz |
| Device information | length, width and height | 1072×1481×1940 mm |
| weight | 1700 Kg |
BBD blade damage detection
NCS non-contact height measurement
Online knife sharpening
Fully automatic dicing
More features or custom features
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silicon wafer
Silicon carbideSiC
Lithium tantalate/lithium niobate
gallium arsenide
FOPLP glass substrate
LED packaging
integrated circuit
Ceramic substrate
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Focusing on the fields of high-precision sealing, grinding and polishing technology, we are committed to providing advanced integrated solutions for independent, serialized and intelligent semiconductor domestic equipment and supporting processes.
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