8-inch fully automatic grinding equipment
AG6800
AG6800 is a high-precision, fully-automatic two-axis three-station grinding equipment for the 4-8-inch semiconductor wafer grinding process. It is specially used for precision grinding processing of mainstream semiconductor materials such as Si, GaN, SiC, and sapphire, achieving full process automation coverage. It supports ultra-thin wafer processing and handling and is compatible with 6-8-inch wafers. It is equipped with real-time high-precision thickness measurement, vacuum warning, automatic cleaning and other functions. It is equipped with a spindle circulating water and air source protection system. It also supports functional modularization and software customization to meet stringent processing accuracy and productivity requirements.
Processing size
Spindle configuration
| Classification | Parameter name | Parameter value |
|---|---|---|
| Processing size | - | 6"~8" |
| Configuration | Spindle form | Double spindle |
| Spindle | Output power | 4.5/7.5 kW |
| Speed range | 1000-5000 rpm | |
| Z axis | itinerary | 120 mm |
| Minimum feed speed | 6 μm/min | |
| Fast movement speed | 2 mm/s | |
| Minimum displacement | 0.1 μm | |
| altimeter | Measuring range | ±1 mm |
| resolution | 0.1 μm | |
| Repeat accuracy | ＜0.5 μm | |
| Vacuum suction cup | Suction cup type | porous ceramic suction cup |
| Speed range | 0-300 rpm | |
| Cleaning method | Whetstone brush cleaning | |
| grinding wheel | diamond grinding wheel | Φ209 mm |
| Vacuum pump | vacuum pressure | -90 kPa (water ≥15℃ flow ≥3L/min) |
| Power | 1.5 kW | |
| water consumption | 3 L/min | |
| Processing accuracy | Single wafer thickness difference | ≤3 μm |
| Different wafer thickness differences | ≤3 μm | |
| Processed surface roughness | Ra0.2 μm (325#) Ra0.02 μm (2000#) | |
| Device information | Width, depth and height | 1200×2800×1900 mm |
| weight | ≈4100 Kg |
Z-direction micro-feed control system
Grinding multiple pieces simultaneously
Real-time high-precision wafer thickness measurement
Ultra-thin wafer processing
More features or custom features
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silicon wafer
Silicon carbide SiC wafer
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