AR9000RR

12-inch fully automatic wafer ring dicing equipment

working size		Φ12"
Spindle	Configuration method	single spindle
	Output power	1.2/1.8/2.4/3.0 kW at 30,000rpm
	Speed range	3,000 - 60,000 rpm
Blade size		Maximum Φ58mm
Y axis	Cuttable range	210 mm
	Single step amount	0.0001 mm
	In place accuracy	< 0.008 mm/210 < 0.002 mm/5
X axis	Cuttable range	210 mm
Z axis	Movement resolution	0.00005 mm
	Repeat accuracy	0.001 mm
θ axis	Maximum rotation angle	380°
Ring dicing accuracy		±50 μm
Wafer positioning accuracy		±50 μm
Single chip efficiency		8 min/pcs
Multi-chip efficiency		Up to 4 pieces can be processed simultaneously
Working voltage		Three-phase 380V 50Hz
Device information	length, width and height	2209×1554×2071 mm
	weight	≈ 2800 Kg

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