AG6800

8-inch fully automatic grinding equipment

Processing size	-	6"~8"
Configuration	Spindle form	Double spindle
Spindle	Output power	4.5/7.5 kW
	Speed range	1000-5000 rpm
Z axis	itinerary	120 mm
	Minimum feed speed	6 μm/min
	Fast movement speed	2 mm/s
	Minimum displacement	0.1 μm
altimeter	Measuring range	±1 mm
	resolution	0.1 μm
	Repeat accuracy	＜0.5 μm
Vacuum suction cup	Suction cup type	porous ceramic suction cup
	Speed range	0-300 rpm
	Cleaning method	Whetstone brush cleaning
grinding wheel	diamond grinding wheel	Φ209 mm
Vacuum pump	vacuum pressure	-90 kPa (water ≥15℃ flow ≥3L/min)
	Power	1.5 kW
	water consumption	3 L/min
Processing accuracy	Single wafer thickness difference	≤3 μm
	Different wafer thickness differences	≤3 μm
	Processed surface roughness	Ra0.2 μm (325#) Ra0.02 μm (2000#)
Device information	Width, depth and height	1200×2800×1900 mm
	weight	≈4100 Kg

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