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Core creates the future | Jingchuang Advanced successfully concluded SEMICON CHINA 2024

March 22, 2024

From March 20th to 22nd, SEMICON China 2024, the world's largest and highest-level annual semiconductor industry event, was held at the Shanghai New International Expo Center. As a leading domestic manufacturer of professional semiconductor grinding and scribing equipment, Jingchuang Advanced was invited to participate in this semiconductor industry event (booth number E7-7443&7343) to answer questions for on-site exhibitors and purchasers and win more market opportunities.

During the three-day industry event, Jingchuang's advanced booth was bustling with people every day. There are both loyal old customers and expectant new customers from home and abroad. They come in droves and show great concern and enthusiasm for Jingchuang's semiconductor polishing and scribing equipment. Yang Yunlong, general manager of Jingchuang, and other core team members stayed at the booth throughout the entire process, receiving visitors from all walks of life with full enthusiasm, answering various questions in detail, and discussing in depth cooperation opportunities and technological innovations. They vividly interpreted the company's core values ​​of "putting customers first, taking pride in contributors, insisting on open cooperation, and continuing to improve and innovate."

This time, Jingchuangxian brought a new model - AG9500 fully automatic grinding equipment to its Semicon China 2024 booth for the first time. This equipment is compatible with the processing of 8-12-inch ultra-thin wafers. It has a dual-spindle configuration and can switch between fully automatic and semi-automatic modes. Multi-station collaborative work ensures high processing efficiency. In addition, equipment exhibited at the same time include JDV-9230 JIG SAW dicing and sorting all-in-one machine, AG6800 fully automatic grinding machine, AR9000 fully automatic dicing machine, etc.

SEMICON CHINA 2024 ended successfully, and Jingchuang Advanced had a perfect ending. "Cross-border global, connected heart to heart", taking the theme of the conference as an opportunity, we will continue to forge ahead and strive to create higher-quality products and services. We look forward to joining hands with you again in the new year to share the industry feast and create a better future!

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Focusing on the fields of high-precision sealing, grinding and polishing technology, we are committed to providing advanced integrated solutions for independent, serialized and intelligent semiconductor domestic equipment and supporting processes.

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