8-inch automatic precision dicing equipment
AR6000
AR6000 is a single-axis automatic precision dicing machine that is suitable for precision dicing of 8-inch silicon wafers, ceramics, PCB boards and other materials. It is widely used in semiconductor industries such as IC, LED, MEMS, photovoltaics, and medical equipment. This equipment integrates automatic alignment, dicing and knife mark detection functions, with high production efficiency; it adopts imported precision transmission and closed-loop control to ensure stable dicing accuracy; it supports customized adaptation, convenient Wafer/PKG switching, and excellent reliability. It also has the outstanding advantages of small footprint and high cost performance.
Processing size
Spindle configuration
| Classification | Parameter name | Parameter value |
|---|---|---|
| Processing size | - | 8" / 205×205 mm |
| Spindle | Output power | 1.2/1.8/2.4/3.0 kW（30,000 rpm） |
| Speed range | 6,000 - 60,000 rpm | |
| Y axis | itinerary | 58 mm |
| X-axis | resolution | 0.0001 mm |
| Accuracy | 0.002 mm | |
| Z axis | speed range | 0.1 - 500 mm/s |
| θ axis | resolution | 0.001 mm |
| power supply | - | 220V 50Hz |
| Device information | Width, depth and height | 760×1000×1600 mm |
| weight | 650 Kg |
BBD blade damage detection
NCS non-contact height measurement
Online knife sharpening
automatic alignment
More features or custom features
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silicon wafer
Silicon carbideSiC
Lithium tantalate/lithium niobate
gallium arsenide
FOPLP glass substrate
LED packaging
integrated circuit
Ceramic substrate
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Focusing on the fields of high-precision sealing, grinding and polishing technology, we are committed to providing advanced integrated solutions for independent, serialized and intelligent semiconductor domestic equipment and supporting processes.
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