12-inch automatic precision scribing equipment
AR7000
AR7000 is a large-size single-axis automatic precision dicing machine that can be used for precision dicing of 12-inch IC, PCB, ceramics, glass and other materials. It is widely used in 8-12-inch IC, LED packaging, optical optoelectronics, communications and other industries. This equipment supports large-size processing of up to 310×310mm, with high production efficiency; it adopts imported precision transmission and closed-loop control, with stable dicing accuracy; it can realize multi-piece dicing of large package substrates, and is equipped with an imported spindle and EtherCAT bus, which is energy-saving, space-saving, and excellent in reliability.
Processing size
Spindle configuration
| Classification | Parameter name | Parameter value |
|---|---|---|
| Processing size | - | 12" / 310×310 mm |
| Spindle | Output power | 1.2/1.8/2.4/3.0 kW(30,000 rpm) |
| Speed range | 6,000 - 60,000 rpm | |
| Y axis | itinerary | 58 mm |
| X-axis | resolution | 0.0001 mm |
| Accuracy | 0.002 mm | |
| Z axis | speed range | 0.1 - 600 mm/s |
| θ axis | resolution | 0.001 mm |
| power supply | - | 380V 50Hz |
| Device information | Width, depth and height | 1050×1100×1780 mm |
| weight | 1000 Kg |
BBD blade damage detection
NCS non-contact height measurement
Online knife sharpening
automatic alignment
More features or custom features
WelcomeContact usGet exclusive solutions
silicon wafer
Silicon carbideSiC
Lithium tantalate/lithium niobate
gallium arsenide
FOPLP glass substrate
LED packaging
integrated circuit
Ceramic substrate
Need a customized solution?
Our team of technical experts will tailor the optimal equipment configuration solution for you
And provide full-process technical support and service guarantee
Focusing on the fields of high-precision sealing, grinding and polishing technology, we are committed to providing advanced integrated solutions for independent, serialized and intelligent semiconductor domestic equipment and supporting processes.