8-inch fully automatic wafer ring dicing equipment

AR6100RR

AR6100RR is a fully automatic ring dicing and ring removal equipment specially built for the 8-inch TAIKO process. It adopts a panoramic window design, has sufficient maintenance space, and the doors do not interfere with each other, making the operation safe and reliable. The equipment continues to use three-point claw positioning and backlight alignment technology, and has been upgraded to include closed-loop motor control, slope positioning claws and photoelectric zero return sensing. It is equipped with a three-point double locking leveling structure to achieve higher positioning accuracy and repeatability. It does not require repeated zero returns and can effectively avoid mucosal risks. The back-lit alignment method has no graphic interference, clear boundaries and fewer alarms. It is supplemented by light-transmitting holes and light source cleaning and blowing designs, which comprehensively guarantees the process quality and long-term operation stability of ring dicing and ring removal.

Processing size

Φ 8"

Spindle configuration

single spindle
Download information
Classification Parameter name Parameter value
working size Φ8"
Spindle Configuration method single spindle
Output power 1.2/1.8/2.4/3.0 kW at 30,000rpm
Speed range 3,000 - 60,000 rpm
Blade size Maximum Φ58mm
Y axis Cuttable range 210 mm
Single step amount 0.0001 mm
In place accuracy < 0.008 mm/210 < 0.002 mm/5
X axis Cuttable range 210 mm
Z axis Movement resolution 0.00005 mm
Repeat accuracy 0.001 mm
θ axis Maximum rotation angle 380°
Ring dicing accuracy ±50 μm
Wafer positioning accuracy ±50 μm
Single chip efficiency 8 min/pcs
Multi-chip efficiency Up to 4 pieces can be processed simultaneously
Working voltage Three-phase 380V 50Hz
Device information length, width and height 2209×1554×2071 mm
weight ≈ 2800 Kg
BBDBlade damage detection

BBD blade damage detection

NCS

NCS non-contact height measurement

Online knife sharpening

Online knife sharpening

Fully automatic work

Fully automatic dicing

More features or custom features
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wafer

TAIKO process wafer

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