12-inch fully automatic precision dicing equipment
AR9000W
AR9000W is a 12-inch dual-axis fully automatic precision dicing machine specially designed for WAFER. It adopts a space-saving compact design and has both efficient maintenance and precise dicing capabilities. It achieves waste-free processing through X/Y/Z three-axis servo synchronization control, greatly improving production efficiency; equipped with a high-performance spindle and internal spiral cleaning nozzle, the dicing quality and cleaning effect are excellent; the optimized user interface improves operational convenience, and at the same time, relies on energy-saving mode, optimized system algorithms and visual models to achieve high reliability and sustainable development.
Processing size
Spindle configuration
| Classification | Parameter name | Parameter value |
|---|---|---|
| working size | - | Φ8"、Φ12" |
| Configuration | Spindle form | biaxial |
| Spindle | Output power | 1.2/1.8/2.4/3.0 kW |
| Maximum speed | 60000 rpm | |
| Blade size | - | 2" |
| Y1/Y2 axis | Single step amount | 0.0001 mm |
| In place accuracy | ＜0.002 mm | |
| Dicing range | 310 mm | |
| X-axis | Feed speed input range | 0.1-600 mm/s |
| Z1/Z2 axis | Single step amount | 0.0001 mm |
| In place accuracy | ≤0.001 mm | |
| θ axis | In place accuracy | ±15″ |
| Washing station | Rotation speed | 100-3000 rpm |
| Cleaning method | Fully automatic rinse and dry | |
| Working voltage | - | Three-phase 380V 50Hz |
| Device information | length, width and height | 1255×1550×1880 mm |
| weight | 2100 Kg |
BBD blade damage detection
NCS non-contact height measurement
Online knife sharpening
Fully automatic dicing
More features or custom features
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silicon wafer
Silicon carbideSiC
Lithium tantalate/lithium niobate
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