12-inch automatic grinding equipment
AG7500
AG7500 is a single-axis automatic precision grinding machine that supports up to 12 inches. It can perform precision grinding processing of a variety of hard and brittle semiconductor materials such as sapphire, silicon wafers, silicon carbide, and gallium nitride. The equipment adopts a high-rigidity and low-vibration design, leading the industry in grinding accuracy in the field of power devices (TTV ≤ 3um, WTW ≤ ± 2um). It is equipped with a Linux system architecture with strong stability and a processing breakage rate of ≤ 1/10000. It also supports single-chip and multi-chip grinding modes. It has good customization capabilities and can be flexibly configured according to customer needs.
Processing size
Spindle configuration
| Classification | Parameter name | Parameter value |
|---|---|---|
| Processing size | - | Φ6″, Φ8″, Φ12″, multiple pieces customized |
| Configuration | Spindle form | single spindle |
| Spindle | Output power | 7.5 kW |
| Speed range | 1000-4000 rpm | |
| Z axis | itinerary | 80 mm |
| Minimum feed speed | 6 μm/min | |
| Fast movement speed | 2 mm/s | |
| Minimum displacement | 0.1 μm | |
| altimeter | Measuring range | ±1 / ±2 / 10 / 40 mm |
| resolution | 0.1 μm | |
| Repeat accuracy | ＜0.5 μm | |
| Vacuum suction cup | Suction cup type | porous ceramic suction cup |
| Speed range | Regular: 0-300 rpm Multi-chip: 0-200 rpm | |
| Cleaning method | Whetstone manual cleaning | |
| grinding wheel | diamond grinding wheel | Φ313 mm |
| Vacuum pump | vacuum pressure | -90 kPa (water ≥15℃ flow ≥3L/min) |
| Power | 1.5 kW | |
| water consumption | 3 L/min | |
| Processing accuracy | Single wafer thickness difference | ≤5 μm |
| Different wafer thickness differences | ≤5 μm | |
| Processed surface roughness | Ra0.2 μm (325#) Ra0.02 μm (2000#) | |
| Device information | Width, depth and height | 840x1920x1750 mm |
| weight | ≈2100 Kg |
Z-direction micro-feed control system
Grinding multiple pieces simultaneously
Real-time high-precision wafer thickness measurement
Ultra-thin wafer processing
More features or custom features
WelcomeContact usGet exclusive solutions
silicon wafer
Silicon carbide SiC wafer
compound semiconductor
Need a customized solution?
Our team of technical experts will tailor the optimal equipment configuration solution for you
And provide full-process technical support and service guarantee
Focusing on the fields of high-precision sealing, grinding and polishing technology, we are committed to providing advanced integrated solutions for independent, serialized and intelligent semiconductor domestic equipment and supporting processes.
Follow our updates
Scan the QR code to get the latest product information and company news
WeChat public account
