AG7500

12-inch automatic grinding equipment

Processing size	-	Φ6″, Φ8″, Φ12″, multiple pieces customized
Configuration	Spindle form	single spindle
Spindle	Output power	7.5 / 1.2 kW
	Speed range	1000-4000 rpm
Z axis	itinerary	80 mm
	Minimum feed speed	6 μm/min
	Fast movement speed	2 mm/s
	Minimum displacement	0.1 μm
altimeter	Measuring range	±1 / ±2 / ±5 / ±25 mm
	resolution	0.1 μm
	Repeat accuracy	≤ ±0.5 / ≤±1 / ≤±15 / ≤±25 μm
Vacuum suction cup	Suction cup type	porous ceramic suction cup
	Speed range	Regular: 0-300 rpm Multi-chip: 0-200 rpm
	Cleaning method	Whetstone manual cleaning
grinding wheel	diamond grinding wheel	Φ313 mm
Vacuum pump	vacuum pressure	-90 kPa (water ≥15℃ flow ≥3L/min)
	Power	1.5 kW
	water consumption	3 L/min
Processing accuracy	Single wafer thickness difference	≤3 μm
	Different wafer thickness differences	≤3 μm
	Processed surface roughness	Ra0.2 μm (325#) Ra0.02 μm (2000#)
Device information	Width, depth and height	840x1920x1750 mm
	weight	≈2100 Kg

Content coming soon.

Need a customized solution?

Our technical experts will tailor the optimal equipment configuration for you and provide end-to-end technical support and service assurance.