JTA-9612

Fully automatic grinding, polishing, sticking and peeling film all-in-one machine

Processing size	-	Max. 300 mm（8"/12"）
Configuration	Spindle form	Three spindles
Spindle	Output power	≥6.3 kW
	Speed range	1000-4000 rpm
Z axis	Z1/Z2 stroke	120 mm / 65 mm
	Z3 stroke	65 mm
	Feed speed	6 m/min
	Fast movement speed	2 mm/s
	Minimum displacement	0.1 μm
	resolution	0.1 μm
altimeter	Measuring range	0-1250 μm
	resolution	0.1 μm
	Repeat accuracy	±0.5 μm
X axis (Z3)	itinerary	290 mm
	resolution	2 μm
	Movement speed	≤200 mm/s
Vacuum suction cup	Suction cup type	porous ceramic suction cup
	Quantity	4
	Speed range	0-300 rpm
	Cleaning method	Whetstone automatic cleaning
grinding wheel	diamond grinding wheel	Φ313 mm
	polishing wheel	Dry polishing wheel Φ458 mm
Vacuum pump	vacuum pressure	-90 kPa (water ≥15℃ flow ≥3L/min)
	Power	1.5 kW
	water consumption	3 L/min
Processing accuracy (grinding and polishing)	Single wafer thickness difference	≤2.5 μm
	Difference in thickness of wafers in the same batch	≤3 μm
	surface roughness	Ra0.2 μm (325#) Ra0.02 μm (2000#) Ra0.005 μm (Polishing)
UV unit	-	Air cooling, temperature monitoring
Non-contact edge finder	-	Have
heater	temperature range	MAX 100°C ±3°C
Processing accuracy (sticking and tearing film)	Wafer placement accuracy	X/Y ±0.5 mm ±0.5°C
	Dicing tape accuracy	X/Y ±1 mm
Device information	Width, depth and height	3300×4400×1800 mm
	weight	9100 Kg

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