Customized solutions
Customized solutions
We provide integrated services from equipment customization, process development to mass production introduction. We are equipped with a professional packaging process laboratory and technical team. We can conduct exclusive process parameter debugging and solution optimization according to customers' different packaging structures, material characteristics and yield requirements, effectively improving the processing accuracy and production efficiency of the packaging process, and helping customers achieve high-reliability packaging and testing mass production in the fields of power devices, optical communications, automotive electronics and other fields.
Focusing on the fields of high-precision sealing, grinding and polishing technology, we are committed to providing advanced integrated solutions for independent, serialized and intelligent semiconductor domestic equipment and supporting processes.