Customized solutions
Fully automatic MicroLED panel dicing solution
As the display panel, semiconductor and microelectronics industries develop towards higher precision and higher integration, high-precision dicing of hard and brittle materials (such as glass, LCD panels, etc.) has become a crucial link in the industrial chain.
This solution integrates full-process automation from panel handling, VCR scanning and alignment, grinding wheel dicing, AOI visual inspection, waste edge removal to cleaning and drying, and is designed to meet the core process requirements for precision, cleanliness and intelligent production of high-end display panels.
Applicable processing dimensions
6–18-inch LCD panel
Applicable industry types
Display panel/LCD panel manufacturing
Core technical specifications
Key process parameters and performance indicators
Solution advantages
Why Choose Jingchuang Advanced Customization Solution
Ultra-high precision dicing
The dicing accuracy is ≤8μm, and the edge chipping is controlled within 20μm, ensuring that the cutting edge quality reaches the top standard of the display panel industry.
Full process automation
From loading, code scanning and correction, dicing, AOI detection, waste edge removal to cleaning, drying and unloading, the entire process is automatically completed by robots, with single-person multi-machine operation, significantly reducing manual dependence.
Multiple intelligent detection system
Integrating three intelligent systems: AOI optical detection, BBD blade breakage real-time detection, and NCS non-contact height measurement, it automatically determines waste adhesion and dicing effect after dicing, reducing batch defects caused by tool abnormalities or tool setting errors.
High cleanliness
The equipment's standby interior meets the static Class 100 cleanliness standard and is equipped with ESD electrostatic protection (substrate static electricity ≤±100V). It is equipped with UPS power-off protection to ensure continuous and stable operation of the production line.
Get exclusive customized solutions
Fill out the solution consultation form and our technical experts will contact you within 24 hours to provide you with a tailor-made dicing solution.
Focusing on the fields of high-precision sealing, grinding and polishing technology, we are committed to providing advanced integrated solutions for independent, serialized and intelligent semiconductor domestic equipment and supporting processes.
Follow our updates
Scan the QR code to get the latest product information and company news
WeChat public account
