Special process plan
Backside collapse improvement process for back silver diode wafers
A diode is an electronic device made of semiconductor materials (such as silicon, germanium, etc.) and has two electrodes: anode (positive electrode) and cathode (negative electrode). It is turned on when a forward voltage is applied and turned off when a reverse voltage is applied, showing switching characteristics.
The test-cut samples this time are silver-plated diodes on the back. During the test-dicing at the client's factory, the back collapse phenomenon exceeded the standard. Based on years of process accumulation and systematic process optimization, Jingchuang Advanced has successfully solved the problem of back collapse, and the dicing effect fully meets customer requirements.
Key improvement steps
Three-step process optimization to systematically solve the problem of back collapse
Adjust sample dicing depth
By accurately adjusting the dicing depth parameters, the residual stress inside the wafer is released first, and the probability of back collapse is reduced from the root cause.
✓ Function: Release part of the stress and reduce back collapseSelect appropriate mesh blades and process parameters
According to the characteristics of the silver-plated material on the back, blades with suitable mesh sizes are selected, and key process parameters such as spindle speed and feed speed are optimized.
✓ Function: Optimize product quality and minimize edge chippingAfter dicing is completed, expand the film first and then pour the film
Optimize the subsequent process flow. After dicing is completed, film expansion processing is performed first, and then film pouring operation is performed to avoid extrusion and collision between products.
✓ Function: Prevent product extrusion and collision, causing the back coating to fall offComparison before and after optimization
The process optimization effect is remarkable and the back collapse problem is effectively solved
Effect before optimization
The backside chipping during trial dicing at the client's factory exceeded the standard. The silver-plated layer on the backside was prone to chipping and falling off during the dicing process, and the yield could not meet customer requirements.
Optimized effect
Using the AR3000 equipment, the back chipping of the sample has been greatly improved after process optimization. After the film is poured, there is basically no big chipping, which fully meets the customer's quality standards.
Use equipment
Core equipment support process implementation
6-inch fully automatic precision slicing equipment
Jingchuang Advanced AR3000 automatic precision slicing equipment is specially designed for semiconductor precision dicing. It has the characteristics of high precision and high stability. It is the core equipment of this back silver diode back collapse improvement process.
Get exclusive process solutions
If you have similar process difficulties or dicing needs, please contact our process engineer team and we will provide you with tailor-made solutions.
Focusing on the fields of high-precision sealing, grinding and polishing technology, we are committed to providing advanced integrated solutions for independent, serialized and intelligent semiconductor domestic equipment and supporting processes.
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