Special process plan
Double-sided groove TVS dicing optimization
TVS stands for Transient Voltage Suppressor. Among them, trench/double trench TVS has outstanding advantages such as bidirectional protection, ultra-low junction capacitance, high power density, small size, excellent heat dissipation performance, and fast response speed. It is widely used in high-end technical fields such as high-speed communications and data interfaces, new energy vehicles, medical care, aviation, and military industry.
Since application scenarios have strict requirements on reliability, stability and security, TVS chips implement extremely high standards in production, process and quality control. The double-groove structure is a typical difficulty in the industry: after the material is grooved on both sides, the upper and lower dicing stresses are superimposed on each other, and the effective support on the back of the workpiece is greatly weakened. It is easy to vibrate and shift at the moment of dicing, leading to fatal defects such as chipping and cracking. At the same time, the bottom cavity space is small and the chip removal conditions are poor. Combined with the brittleness and poor toughness of the TVS material itself, the risk of edge chipping is further aggravated. It has become a core industry pain point that restricts the efficient and high-precision processing of TVS devices.
Key improvement steps
Three-step process optimization to systematically solve the edge chipping problem in double-groove TVS dicing
Adopt one-knife dicing process
Abandoning the traditional three-stage process of "front shallow grooving + back shallow grooving + split" in the industry, the dicing process is directly completed using a one-knife dicing process, simplifying the process from the source.
✓ Function: Effectively simplify the operation process, reduce the difficulty of operation, significantly improve dicing efficiency and processing stability, and increase the efficiency by 100%Optimize the blade model and finely match the process parameters
In view of the double-groove TVS material characteristics, special blades with high adaptability are selected, and key process parameters such as spindle speed and feed speed are carefully matched based on the characteristics of the machine.
✓ Function: Effectively improve dicing quality, significantly reduce chipping defects, and ensure stable and reliable appearance and performance of finished productsAfter dicing is completed, expand the film first and then pour the film
Optimize the subsequent process flow. After dicing is completed, film expansion processing is performed first, and then film pouring operation is performed to avoid extrusion and collision between products.
✓ Function: It can effectively avoid extrusion and collision of products during transportation, reduce the risk of edge chipping from the source, and ensure the appearance and integrity of the finished dicing products.Comparison before and after optimization
The process optimization effect is remarkable and the back collapse problem is effectively solved
Effect before optimization
Using the traditional three-stage process of "front shallow grooving + back shallow grooving + splintering", the equipment investment cost is high, the labor cost is high, the operation process is complicated, and the stress superposition of the double groove structure leads to a high risk of edge chipping and cracking, and the product yield is difficult to guarantee.
Optimized effect
Using the one-knife dicing process, the dicing efficiency is increased by 100%, and equipment investment and labor costs are significantly reduced. By selecting special blades with high adaptability and finely matching process parameters, the stable application of the one-blade dicing process is achieved, and the overall optimization of dicing quality is completed while ensuring high efficiency.
Use equipment
Core equipment support process implementation
6-inch fully automatic precision slicing equipment
Jingchuang Advanced AR3000 automatic precision slicing equipment is specially designed for precision dicing of semiconductor wafers. It has the characteristics of high precision and high stability. It is the core equipment of this back silver diode back collapse improvement process.
Get exclusive process solutions
If you have similar process difficulties or dicing needs, please contact our process engineer team and we will provide you with tailor-made solutions.
Focusing on the fields of high-precision sealing, grinding and polishing technology, we are committed to providing advanced integrated solutions for independent, serialized and intelligent semiconductor domestic equipment and supporting processes.
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