From August 31 to September 2, CSEAC 2026 Semiconductor Equipment Materials and Core Components Exhibition was held in the Taihu Lake International Expo Center in Wuxi. As a domestic force deeply involved in semiconductor post-processing equipment such as cutting, grinding, and polishing, Jingchuang Advanced showcased its full range of products and process solutions at booth A3-223. During the three-day exhibition, the booth remained bustling with people - this industry event at our doorstep is not only a reunion with old friends after a long separation, but also a new starting point for cooperation with new partners.

Home game, booth popularity continues to soar

The Yangtze River Delta is the foundation of Beijing's advanced growth, and the team regards this exhibition in Wuxi as the true 'home field'. During the three-day exhibition, a continuous stream of professional visitors engaged in in-depth discussions on topics such as ultra-thin wafer thinning, precision cutting, and polishing processes; A series of intensive negotiations were held at the booth, covering equipment parameters, process validation, and production line planning. The topics became more specific with each meeting, and many customers agreed on the samples and plans to deepen after the meeting.

The entire range of cutting, grinding, and polishing has been unveiled, and the one-stop solution has attracted attention

At this exhibition, Jingchuang Advanced showcased its core equipment covering three product lines: slicing, thinning, and polishing: star products JTA-9612 Fully Automatic Thinning, Polishing, Adhesive and Tearing Film MachineAdopting an in feed thinning and polishing integrated design, thinning and polishing are continuously completed on the same equipment, providing stable support for the mass production of ultra-thin wafers;Jingchuang Advanced Series Fully Automatic Cutting Machine Covering 6-12 inch precision cutting;Series automatic thinning machine Targeting mainstream production lines; Develop a complete post-processing solution from cutting, thinning to polishing.

Full coverage of hard and brittle materials, SiC and optoelectronic scenes become new hotspots

exhibition scene,Silicon carbide, gallium nitride The thinning and polishing process of equal width bandgap semiconductors has become one of the most focused topics for audience inquiries. The demand for ultra-thin wafers in power semiconductors makes "backside thinning+stress relief" an essential step that cannot be bypassed; At the same time, precision machining solutions for hard and brittle materials such as sapphire, optical glass, and ceramics have also attracted professional audiences in the field of optoelectronics to stop and exchange ideas.

Industry voice: Domestic equipment is shifting from 'whether it is available' to 'whether it is good or not'

From the technical forum held during the exhibition to every exchange at the booth, we can feel a common direction: the localization of integrated circuit microfabrication equipment is moving from "whether it exists" to "whether it is good or not". The customer's concern has shifted from 'can it be done' to 'whether mass production is stable or not, and whether the yield meets the standard'. As a domestic supplier of cutting, grinding, and polishing equipment that is independent, serialized, and intelligent, Jingchuang Advanced will continue to invest in research and development and process validation, making "stable mass production" the strongest confidence for domestic equipment.