Advanced Dicing, Grinding and Polishing solutions
Break through manufacturing limits
JCA provides high-precision, high-yield semiconductor process equipment and integrated solutions for customers worldwide.
Trusted by industry leaders
Advanced equipment across dicing, grinding and polishing
AR9000W
12-inch fully automatic precision dicing equipment
AG7500
12-inch automatic grinding equipment
AG9500
12-inch fully automatic grinding equipment
JTA-9612
Fully automatic grinding, polishing, sticking and peeling film all-in-one machine
JDV-9230B
Fully automatic JIGSAW cutting equipment
ARP9100
Fully automatic dicing and sorting integrated equipment
JDV-9230
Fully automatic dicing and sorting machine
AC800
8-inch cleaning equipment
Committed to becoming a leader in
Dicing, Grinding and Polishing technology
News from JCA
How to choose advanced slicing machines, thinning and cutting sorting equipment from Jingchuang? Recommended models based on conditions
From wafer slicing, 8/12 inch thinning, to thinning, polishing, film peeling, and packaging product cutting and sorting, understand the main equipment and selection points of Jingchuang Advanced by process.
Jingchuang AR9000 has obtained domestic pilot certification results, conveying customer confidence through actual testing performance
Jingchuang Advanced has been awarded the Certificate of Verification Results for Domestic Equipment and Components by Pinghu Laboratory
Deeply cultivating the new blue ocean of Southeast Asian semiconductors | Jingchuang Advanced SEMICON SEA 2026 successfully concludes
On May 7th, the three-day SEMICON SEA 2026 officially concluded at the Kuala Lumpur Convention and Exhibition Center in Malaysia.