12-inch dual-axis automatic precision dicing equipment
AR8000
AR8000 is a large-size two-axis automatic precision dicing machine that can be used for precision dicing of 12-inch silicon wafers, PCBs, ceramics, glass and other materials. It is widely used in 8-12-inch IC, LED packaging, optical optoelectronics, communications and other industries. The equipment supports large-size processing of 12 inches or 310×310mm and has high production efficiency. It adopts imported precision transmission and closed-loop control to ensure stable dicing accuracy. It can realize multi-piece dicing of large package substrates. It is also equipped with imported spindles and the first EtherCAT bus in China, which is energy-saving, space-saving, and excellent in reliability.
Processing size
Spindle configuration
| Classification | Parameter name | Parameter value |
|---|---|---|
| Processing size | - | 12" / 310×310 mm |
| Spindle | Output power | 1.2/1.8/2.4/3.0 kW（30,000 rpm） |
| Speed range | 6,000 - 60,000 rpm | |
| Y axis | itinerary | 58 mm |
| X-axis | resolution | 0.0001 mm |
| Accuracy | 0.003 mm | |
| Z axis | speed range | 0.1 - 600 mm/s |
| θ axis | resolution | 0.001 mm |
| power supply | - | 380V 50Hz |
| Device information | Width, depth and height | 1300×1020×1800 mm |
| weight | 1400 Kg |
BBD blade damage detection
NCS non-contact height measurement
Online knife sharpening
automatic alignment
More features or custom features
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silicon wafer
Silicon carbideSiC
Lithium tantalate/lithium niobate
gallium arsenide
FOPLP glass substrate
LED packaging
integrated circuit
Ceramic substrate
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