20-inch automatic precision scribing equipment
AR8100
AR8100 is an extra-large fully automatic bi-axis precision dicing machine that supports products up to 20 inches/500x500mm. It is suitable for dicing silicon wafers, ceramics, PCB boards, EMC, quartz, glass and other materials. It is widely used in IC, LED, MEMS, photovoltaic, medical equipment and other industries. It supports up to 500×500mm ultra-large size processing, adopts a dual-axis high-efficiency dicing mode, and is about 80% more efficient than a single machine; equipped with precision imported transmission and closed-loop control, the dicing accuracy is stable; it supports multi-piece dual-knife dicing on the same plate, automatic calibration and knife mark detection. The dicing frame and table can be customized to adapt to complex processes, with comprehensive functions and outstanding efficiency.
Processing size
Spindle configuration
| Classification | Parameter name | Parameter value |
|---|---|---|
| Processing size | - | 20" / 500×500 mm |
| Spindle | Output power | 1.8/2.4/3.0 kW（30,000 rpm） |
| Speed range | 6,000 - 60,000 rpm | |
| Y axis | itinerary | 110 mm |
| X-axis | resolution | 0.0001 mm |
| Accuracy | 0.008 mm | |
| Z axis | speed range | 0.1 - 600 mm/s |
| θ axis | resolution | 0.001 mm |
| power supply | - | 380V 50Hz |
| Device information | Width, depth and height | 1350×1720×1840 mm |
| weight | 1600 Kg |
BBD blade damage detection
NCS non-contact height measurement
Online knife sharpening
automatic alignment
More features or custom features
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silicon wafer
Silicon carbideSiC
Lithium tantalate/lithium niobate
gallium arsenide
FOPLP glass substrate
LED packaging
integrated circuit
Ceramic substrate
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Focusing on the fields of high-precision sealing, grinding and polishing technology, we are committed to providing advanced integrated solutions for independent, serialized and intelligent semiconductor domestic equipment and supporting processes.
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