When selecting cutting equipment, thinning equipment, or JIGSAW equipment, it is usually easier to find a matching solution by first explaining "what material to process, what size to measure, which process to complete, and what kind of automation is required", rather than simply comparing model parameters.
Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. (referred to as "Jingchuang Advanced") focuses on high-precision cutting, grinding, and polishing technologies, providing equipment such as slicing, thinning, polishing, and JIGSAW. This article provides preliminary recommended directions based on advanced standard models from Jingchuang.
The "priority evaluation" in the text is the starting point for determining candidate models. The dimensions in the text are within the nominal processing range of publicly available information, and the actual selection should also be confirmed based on materials, thickness, film frame, fixtures, quality standards, and sample results.
1、 Scribing: First confirm the size, then check the spindle and automation configuration
The selection of slicing should first clarify whether the workpiece is a wafer, packaged product, or other substrate material, and then confirm whether it is conventional segmentation or TAIKO ring cutting. The cutting and fixing methods of workpieces such as silicon wafers, ceramics, glass, and PCBs are different, and the model cannot be determined solely based on the same size.
Single spindle precision cutting: Select according to workpiece size
If processing 6-inch wafers or square workpieces not exceeding 160 × 160mm and choosing a single spindle processing solution, it is recommended to prioritize evaluationAR3000.
If processing 8-inch wafers or square workpieces not exceeding 205 × 205mm requires single spindle precision cutting, it is recommended to prioritize evaluationAR6000.
If processing 12 inch wafers or square workpieces not exceeding 310 × 310mm requires single spindle precision cutting, it is recommended to prioritize evaluationAR7000.
The above models have automatic processing functions (automatic alignment, cutting, and knife mark detection, etc.); Whether automatic loading and unloading, material box transportation, or connection with other equipment is required needs to be confirmed separately.
Dual spindle and large-sized cutting: choose according to the processing method
If the workpiece is a 12 inch wafer or within a 310 × 310mm square processing range, and the process requires the use of opposing dual spindle cutting, it is recommended to prioritize evaluationAR8000.
If the square workpiece exceeds the nominal machining range of the 310 × 310mm model but is within the range of 500 × 500mm, or if there is a dual spindle machining requirement for 20 inch level workpieces, it is recommended to prioritize evaluationAR8100And first confirm the shape of the workpiece, actual side length, and cutting frame configuration.
Fully automatic slicing: distinguishing wafers from packaged products
If 8-inch wafer processing is the main focus and dual spindle cutting, as well as automatic loading and unloading, cleaning, and other functions are required, it is recommended to prioritize evaluationAR6820.
If the processing object is an 8/12 inch wafer (WAFER) and requires fully automatic loading and unloading, alignment, cleaning, and knife mark detection functions, it is recommended to prioritize evaluationAR9000WAt present, projects mainly focusing on 8 inches and requiring evaluation of 12 inch compatibility solutions in the future can also include AR9000W as a candidate and confirm the size switching configuration.
If the processing object is a packaged product or packaging substrate (PKG), and the workpiece is within 280 × 280mm, dual spindle fully automatic cutting is required. It is recommended to prioritize evaluationAR9000Square packaged products should be confirmed based on their actual length, width, and fixing method, and compatibility cannot be judged solely by the name of the "12 inch model".
TAIKO Loop Cutting: Select by Wafer Size
The processes undertaken by the ring cutting equipment and conventional slicing equipment are not the same. If it is necessary to complete the ring cutting, outer ring debonding, and ring removal of 8-inch TAIKO wafers, it is recommended to prioritize evaluationAR6100RR.
If it is a similar process for 12 inch TAIKO wafers, it is recommended to prioritize evaluationAR9000RR.
2、 Thinning: Consider thickness, surface condition, and subsequent processes together
Compound semiconductors such as silicon and silicon carbide (SiC), as well as materials such as glass and ceramics, have different requirements for grinding wheels, clamping, and measurement methods. The selection of thinning machines can be based on size and automated screening, and then the process plan can be determined based on actual materials.
6/8-inch wafer, requiring fully automatic thinning
If processing 6/8-inch wafers requires dual spindle grinding, fully automatic loading and unloading, and cleaning functions, it is recommended to prioritize evaluationAG6800And confirm the grinding and cleaning configuration based on the sample.
8/12 inch wafer, requiring fully automatic thinning
If processing 8/12 inch wafers requires dual spindle grinding, fully automatic loading and unloading, and cleaning functions, it is recommended to prioritize evaluationAG9500For the 8-inch project, both AG6800 and AG9500 can be considered as candidates, and a comprehensive comparison should be made based on future size planning, process and production line integration.
8/12 inch workpiece, requiring single spindle or multiple pieces, customized solutions for irregular shapes
If processing 8/12 inch workpieces, single spindle thinning is required, or customized grinding solutions for multiple or irregular workpieces need to be evaluated, it is recommended to prioritize evaluationAG7100And confirm the fixing method between the dedicated suction cup and the workpiece.
All thinning projects should also specify the initial thickness, target thickness, total thickness variation (TTV), surface condition, and handling requirements.
3、 Thinning and polishing adhesive film tearing: pay attention to process connection
If processing 8/12 inch wafers requires integrating processes such as backside thinning, polishing, and film coating/tearing into the same equipment system, it is recommended to prioritize evaluationJTA-9612Fully automatic thinning, polishing, pasting, and film tearing machine.
If the project only requires independent equipment for thinning, polishing, film pasting and tearing, it is recommended to prioritize evaluationAGL9600Further determine whether process integration is necessary.
For ultra-thin wafers or special materials, the wafer support method, film compatibility, process connection, and cleaning plan should be confirmed item by item during the sample stage. As for whether it is necessary to add a stress relief process and whether the entire solution can achieve the expected quality, it must be determined through process validation.
4、 JIG SAW: Distinguishing between Conventional Cutting Equipment and JIGSAW Cutting Equipment
For packaging products such as QFN, DFN, BGA, LGA, etc., first clarify whether cutting, testing, and sorting need to be completed in the same equipment, and then determine the plan based on the actual substrate size and workbench configuration.
Integration of cutting, testing, and sorting is required
If you need to integrate cutting, cleaning, detection, and sorting, and wish to adopt a dual spindle and dual worktable solution, it is recommended to prioritize evaluationJDV-9230 / ARP9100JDV-9230 is a dual worktable solution, while ARP9100 is a single worktable solution, and the choice depends on the substrate size and loading and unloading cycle.
The selection of JDV-9230 and ARP9100 should take into account the substrate length and width, workpiece fixation, and worktable process simultaneously, and cannot rely solely on "dual worktable" or "single worktable" to determine which one is more efficient. The feeding method and interface with upstream and downstream equipment also need to be confirmed item by item.
There are already independent testing and sorting processes, with a focus on increasing cutting capabilities
If the existing production line is equipped with independent testing and sorting equipment, only cutting, cleaning, and cutting are required this time. It is recommended to prioritize evaluationJDV-9230BThis model focuses on the cutting process and does not include a detection and sorting module.
5、 You can prepare these materials before inquiring about the sample
To facilitate the determination of solutions from the above candidates, it is recommended to prepare the following materials before contacting Jingchuang Advanced to arrange samples:
Material: Specific material name, whether there is a coating or composite structure, and the state before processing.
Dimensions: wafer diameter or square length and width, initial thickness, film frame and fixture information.
Process: Do you need to slice, thin, polish, apply and tear off film, perform ring cutting, clean, or integrate cutting, detection, and sorting.
Automation: Is manual loading and unloading acceptable, and is there a need for material box loading and unloading, automatic transmission, and production line interfaces.
Acceptance: target thickness, cutting or edge requirements, surface quality, measurement methods, and expected production capacity.
This article provides preliminary recommendations based on advanced standard equipment from Jingchuang. The phrase 'can process a certain material' should not be understood as referring to all thickness, structure, and quality requirements applicable to that material. The final model, optional features, and acceptance criteria shall be based on the specifications and sample results confirmed by both parties.
Jingchuang Advanced has a professional pre-sales team to inform you of your specific needs, and we will provide you with selection suggestions based on this. Welcome throughOfficial website consultation entranceContact a professional technical team for communication.