Improvement process of backside collapse of silver diode thin film

Featured Process Scheme · Discrete Devices

In response to the problem of back breakage exceeding the standard during the trial cutting of silver plated diodes in the client's factory, Jingchuang Advanced carried out a three-step systematic optimization from cutting depth, blade selection to the subsequent process, to stably control the edge breakage within the customer's quality standards.

Trial cut sample:Silver plated diode on the back
Using equipment:AR3000

Question background

A diode is an electronic device made of semiconductor materials such as silicon, germanium, etc. It has two electrodes, an anode (positive electrode) and a cathode (negative electrode), with forward conduction and reverse cutoff. It is one of the most basic discrete devices in circuits. The silver plated structure on the back can improve welding and heat dissipation performance, but it also puts higher requirements on the cutting process.

The sample for this trial cutting is a silver plated diode on the back, and there was an excessive phenomenon of back breakage during the customer's factory trial cutting. Based on years of process accumulation, Jingchuang Advanced has successfully solved the problem of back collapse through systematic process optimization, and the cutting effect fully meets customer requirements.

Key improvement steps

Three step process optimization to systematically solve the problem of back collapse.

Step 1 | Adjust the cutting depth of the sample

By precisely adjusting the cutting depth parameters, the residual stress inside the wafer can be released first, reducing the probability of back collapse from the root.

Function: Release some stress and reduce back collapse.

Step 2 | Select appropriate mesh blades and process parameters

Based on the characteristics of the silver plated material on the back, select suitable mesh blades and optimize key process parameters such as spindle speed and feed rate.

Function: Optimize product quality and minimize edge breakage.

Step 3 | Expand the film first and then invert it after cutting is completed

Optimize the post cutting process flow, first perform film expansion treatment after cutting, and then perform film pouring operation to avoid squeezing and collision between products.

Function: To prevent product compression and collision, which may cause the back coating to peel off.

Comparison before and after optimization

Before optimization

There is an excessive phenomenon of back breakage during the trial cutting in the client's factory, and the silver plating layer on the back is prone to edge breakage, detachment, and other problems during the cutting process, resulting in a yield rate that cannot meet customer requirements.

optimized

After using AR3000 equipment and optimizing the process, the back collapse of the sample has been greatly improved. After pouring the film, there are basically no major broken edges during inspection, fully meeting the customer's quality standards.